一、常用PCB專用術(shù)語1

雙面板：double sided board

多層板：multilayer board

剛性板：rigid board

撓性板：flexible board

剛撓板：flex-rigid board

PCB?打樣：PrintedCircuitBoard proofing

附件：attached

樣品：sample

承認(rèn)：approval

答復(fù)：answer;reply

規(guī)格：spec

與...同樣的：the same as

前版本：previous version(old version)?

生產(chǎn)：production

確認(rèn)：confirm

再次確認(rèn)：double confirm

工程問題：engineering query（EQ）?

盡快：ASAP(as soon as possible)

生產(chǎn)文件：production gerber

聯(lián)系某人：contact somebody

提交樣板：submit sample

交貨期：delivery date

電測(cè)成本：ET（electrical test） cost

通斷測(cè)試：Open and short testing

參考：refer to IPC

標(biāo)準(zhǔn)：IPC standard

IPC?二級(jí)：IPC class 2

可接受的：acceptable

二、常用PCB專用術(shù)語2

允許：permit
制造：manufacture

修改：revision

公差：tolerance

忽略：ignore(omit)?

工具孔：tooling hole

安裝孔：mounting hole

元件孔：component hole

槽孔：slot

郵票孔：snap off hole

導(dǎo)通孔：via

盲孔：blind via

埋孔：buried via?

金屬化孔：PTH(plating through hole)

非金屬化孔：NPTH( no plating through hole)

孔位：hole location

避免：avoid

原設(shè)計(jì)：original design

修改：modify

按原設(shè)計(jì)：leave it as it is

附邊：waste tab

銅條：copper strip

拼板強(qiáng)度：panel strong

板厚：board thickness

刪除：remove(delete)

削銅：shave the copper

露銅：copper exposure

光標(biāo)點(diǎn)：fiducial mark

不同：be?different?from(differ?from)

內(nèi)弧：inside radius

焊環(huán)：annular ring

單板尺寸：single size

拼板尺寸：panel size

銑：routing

銑刀：router

V-cut：scoring

啞光：matt

光亮的：glossy?

錫珠：solder?ball(solder?plugs)

三、常用PCB專用術(shù)語3

阻焊：solder mask(solder resist)?

阻焊開窗：solder mask opening

單面開窗：single side mask opening

補(bǔ)油：touch up solder mask

補(bǔ)線：track welds

毛刺：burrs

去毛刺：deburr

鍍層厚度：plating thickness

清潔度：cleanliness?

離子污染：ionic contamination

阻燃性：flammability?retardant?

黑化：black?oxidation

棕化：brown oxidation

紅化：red oxidation

可焊性：solderability

焊料：solder

包裝：packaging

角標(biāo)：corner mark

特性阻抗：characteristic impedance

正像：positive

負(fù)片：negative

鏡像：mirror

線寬：conductor width

線距：conductor spacing

做樣：build sample

按照：as?per

成品：finished

做變更：make?the?chang

相類似：similar to?

規(guī)格：specification

下移：shift down?

垂直地：vertically

水平的：horizontally?

增大：increase

縮小：decrease?

表面處理：Surface?Finishing

波峰焊：wave?solder?

鉆孔數(shù)據(jù)：drilling?date

標(biāo)記：Logo?Ul?

標(biāo)記：Ul Marking

蝕刻標(biāo)記：etched?marking?

周期：date?code

翹曲：bow?and?twist?

外層：outer layer

內(nèi)層：internal?layer?

頂層：top?layer

底層：bottom?layer?

元件面：component?side

焊接面：solder?side?

阻焊層：solder mask?layer

絲印層：legend layer (silkscreen layer or over layer)

四、常用PCB專用術(shù)語4

蘭膠層：peelable?SM?layer?

貼片層：paste?mask?layer

碳油層：carbon layer?

外形層：outline?layer(profile?layer)

白油：white?ink?

綠油：green?ink

噴錫：hot?air?leveling?(HAL)?

水金：flash?gold

插頭鍍金：plated?gold?edge-board?contacts?

金手指：Gold-finger

防氧化：Entek(OSP)?

沉金：Immersion?gold (chem.?Gold)?

沉錫：Immersion?Tin(chem.Tin)?

沉銀：Immersion?Silver?(chem.?silver)?

銑：CNC?(mill?,?routing)?

沖：punching

倒角：beveling?

倒斜角：chamfer

倒圓角：fillet?

尺寸：dimension

總結(jié)

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